TRICONEX 2481 输出模块基板 基板是制造PCB的基本材料

基板是制造PCB的基本材料，一般情况下， 基板就是覆铜箔层压板，单、双面印制板在制造中是在基板材料覆铜箔层压板(Copper CladLaminate，CCL)上，有选择地进行孔加工、化学镀铜、电镀铜、蚀刻等加工，得到所需电路图形。另-多层印制板的制造，也是以内芯薄型覆铜箔板为底基，将导电图形层与半固化片(Pregpr' eg) 交替地经一次性层压黏合在一 起，形成3层以上导电图形层间互连。它具有导电、绝缘和支撑三个方面的功能。印制板的性能、质量、制造中的加工性、制造成本、制造水平等，在很大程度上取决于基板材料。

The substrate is the basic material for manufacturing PCBs. In general, the substrate is a copper clad laminate. Single and double-sided printed boards are manufactured on the substrate material Copper Clad Laminate (CCL), which selectively processes holes, chemical copper plating, electroplating copper, etching, etc. to obtain the required circuit graphics. In addition, the manufacturing of multi-layer printed boards is also based on inner core thin copper clad laminates, which alternately bond the conductive graphic layer and semi cured sheet (Pregpr 'eg) together through one-time lamination, forming interconnections between three or more conductive graphic layers. It has three functions: conductivity, insulation, and support. The performance, quality, processability in manufacturing, manufacturing cost, and manufacturing level of printed boards largely depend on the substrate material.