AO2481 输出模块基板基板是制造PCB的基本材料，一般情况下 ，基板就是覆铜箔层压板，单、双面印制板在制造中是在基板材料-覆铜箔层压板(Copper CladLaminate, CCL) 上, 有选择地进行孔加工、化学镀铜、电镀铜、蚀刻等加工，得到所需电路图形。另-多层印制板的制造，也是以内芯薄型覆铜箔板为底基,将导电图形层与半固化片(Pregpr' eg) 交替地经- -次性层压黏合在一 起， 形成3层以上导电图形层间互连。它具有电、绝缘和支撑三个方面的功能。印制板的性能、质量、制造中的加工性、制造成本、制造水平等,在很大程度上取决于基板材料。
The substrate is the basic material for manufacturing PCBs. In general, the substrate is a copper clad laminate. Single and double-sided printed boards are manufactured on the substrate material - Copper Clad Laminate (CCL), which selectively processes holes, chemical copper plating, electroplating copper, etching, etc. to obtain the required circuit graphics. In addition, the manufacturing of multi-layer printed boards is also based on inner core thin copper clad laminates, which alternately bond the conductive graphic layer with a semi cured sheet (Pregpr 'eg) through secondary lamination to form interconnections between three or more conductive graphic layers. It has three functions: electrical, insulation, and support. The performance, quality, processability in manufacturing, manufacturing cost, and manufacturing level of printed boards largely depend on the substrate material.
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